# Semiconductor & Electronics Inspection

> Acoustic microscopy for packages, power modules and passive components


The parts that fail in service usually fail at an interface: the die lifts off its attach, the ceramic separates from the copper, the solder layer under a power die never bonded across its full area. X-ray resolves density rather than adhesion, so a gap that contains air is close to invisible to it.

Ultrasound is the opposite instrument. Sound does not cross air, so a bonded interface transmits and an unbonded one reflects at full contrast; gate the receiver to the die-attach depth and the C-scan becomes a map of where the bond exists, measured as an area percentage against the limit.

The same cell covers the rest of the package family — MLCC layer separation, DBC and AMB interface voids, wafer-bond voids — because only the transducer frequency and the gate position change. The [SAM-500 scanning acoustic microscope](/products/scanning-acoustic-microscope/) is the platform behind it.